Engineering Services
Craig H. Johnson & Associates specializes in placing Software and Hardware engineers for both contract and permanent placement with a focus on the following technologies.
- Embedded Software: IoT, Device Drivers, Board Bring Up, Linux, QNX, C/C++, Python, WiFi, Socket, MIPI, I2C, SPI
- Firmware: OS/RTOS, DSP, FPGA, C/C++, Power Efficiency
- iOS App: Swift/Objective-C/C++, REST, Networking, Mobile Technology
- Android App: Java, Android SDK/NDK, HTML5/JavaScript/CSS3, OOD, OOP
- Web Application/Server/Full Stack: Java, JavaScript/HTML/CSS, Angular2/React, JQuery, Scala, RESTful, JSON, NodeJS, Spring, Hibernate, SQL, NOSQL, Cassandra, MongoDB, Maven, Junit
- Data Engineer/Scientist: Scala, Java, Hadoop, HBase, Spark
- Security: PKI, AES, SHA, Smart Card, Biometrics, CA/RA, HSM
- QA, Test Automation, Black/Grey/White Box Test: Selenium, TestNG, Python, Java, JMeter, Junit, Bash, SCPI, Linux
- Mobile Test Automation: Appium, Java, iOS/Android UI Automation, Python, Web Services
- ASIC Architect/Micro Architect: ASIC and/or FPGA, System View, Hardware, Software
- ASIC/SoC RTL Logic Design: Verilog, VHDL, C/C++
- ASIC Design Verification: System Verilog, UVM, C/C++, Python
- ASIC Synthesis/Design Flow:
- ASIC Physical Design: Place and Route, Floor Planning, Clock Insertion
- ASIC Static Timing Analysis: PrimeTime
- ASIC Design for Test: BIST, ATPG, Clock Insertion
- Analog/Mixed Signal: Integrated Circuit, CMOS, BiCMOS, SiGe
- Board Design: orCAD, Altium, Schematic Capture, Mixed Signal, Power
- Mechanical Design: Creo, SolidWorks, Thermal, Chassis, Enclosure, DFM, Manufacturability, Finite Analysis, Tolerance Analysis, Documentation
- Manufacturing: Automation, SolidWorks, SheetWorks, Lean Manufacturing, CM/Vendor Management
- Packaging: Label, PLC, Packaging Automation, Certification, CAD, GD&T, Six Sigma
- Electrical Packaging: Package IC, Wedge Wirebonding, Die Attach, JMP, ISO 9001 & 13485
- Cell Development: Battery, Lithium-ion, fuel cells, supercapacitors
- Materials Development: Polymer, Ceramic, Organic/Inorganic, composite development, new chemical, material synthesis, formulation, characterization, FTIR, TGA, GC-MS
- Lab Technician: Synthesis, Fabrication, Testing, Data Collection
- DevOps: Chef, Puppet, Ansible, SaltStack, Jenkins, Jira, Git, Python, Ruby, Network Configuration, Continuous Integration, Continuous Deployment
- Process Development: PLC Programming, CNC, CAD, GD&T
- SCRUM Master: Agile, Jira, Sprint Planning, Daily SCRUM, Retrospective, Trello, Slack
- Project/Program Manager: Scope/Change/Risk/Budget Management, Matrix Management, Interpersonal/Negotiation Skills, Verbal/Written Skills